02Environmental Simulation Test

1. CAF Testing

2. Corrosion Resistance

3. Electrochemical Migration

4. Flammability

5. Steady Humidity

6. Cold Storage

7. Thermal Cycling

8. Salt Spray/Mist

9. Steam Aging

03Failure Analysis

1. CAF/ECM

2. Solderability Verification

3. Fabrication and Assembly Process

4. SEM/EDS Analysis

5. Structural Integrity

6. Blind/Buried Via Microsections

7. BGA Solder Joint Quality Analysis

8. Conductor Width and Space Verification

9. Solderability Analysis

10. Low Insulation Resistance

04Electrical Test

1. Arc Resistance

2. CTI

3. Interconnection Resistance

4. Circuit Continuity

5. Dielectric Breakdown

6. Electrical Strength

7. Insulation Resistance

8. Resistance of Copper Foil

9. Surface Insulation Resistance

10. Volume and Surface Resistivity

11. Dielectric Constant (Permittivity) & Dissipation Factor (Loss Tangent)

12. CAF/ECM

05Environmental Reliability Test

1. Hot Storage

2. Cold Storage

3. Temperature and Humidity Storage

4. Thermal Shock

5. Thermal Cycling

6. Temperature and Humidity Cycling

7. Thermal Aging

8. Salt Mist Test

9. Sand and Dust Test

10. Vibration

11. Mechanical Shock

12. Drop Test

13. Autoclave Test, etc

06Physical Performance Test

1. Dimensional Stability

2. Dimensional Measurement

3. Microsection

4. Plating Adhesion

5. Coating Thickness

6. Glass-Transition Temperature

7. Curing Factor

8. Coefficient of Expansion

9. Time to Delamination

10. Temperature of Delamination

11. Decomposition Temperature

12. Rework

13. FTIR (Transmission & Micro ATR)

14. SEM/EDS

15. Thermal Conductivity Coefficient, Thermal Resistance